Year	2015
Authors	Chiou, Jin-Chern
Paper Title	Chih-Wei Chang, Po-Tsang Huang, Lei-Chun Chou, Shang-Lin Wu, Shih-Wei Lee, Ching-Te Chuang, Kuan-Neng Chen, Jin-Chern Chiou, Wei Hwang, Yen-Chi Lee, Chung-Hsi Wu, Kuo-Hua Chen, Chi-Tsung Chiu, and Ho-Ming Tong, "Through-Silicon-Via Based Double-Side Integrated Microsystem for Neural Sensing Applications," 2013 IEEE International Solid-State Circuits Conference (ISSCC), pp.102-103, San Francisco, CA, February 17-21,2013.
Date of Publication	2015-06-12