Year 2011
Authors Hwang, Ruey-Bing
Paper Title Wei‐Cheng Wu, Ruey‐Bing Hwang, Heng‐Tung Hsu, Yi Chang E., Li‐Han Hsu, Chen‐Hua Huang, Yin‐Chu Hu, Ming‐Iu Lai, “Design of flip‐chip interconnects with vertical coaxial transitions and its fabrication,” Proceeding of Asia‐Pacific Microwave Conference, Suzhou, China, Dec. 4‐7, 2005.
Date of Publication 2011-08-03