Year 2011
Authors Hwang, Ruey-Bing
Paper Title W. C. Wu, E. Y. Chang, R. B. Hwang, H. T. Hsu, L. H. Hsu, C. H. Huang, C. Kärnfelt, and H. Zirath, “Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip‐Chip Interconnects,” IEEE Transactions on Advanced Packaging, Vol. 32, NO. 2, pp 362‐371, 2009.
Date of Publication 2011-08-03