Year	2015
Authors	Chiou, Jin-Chern
Paper Title	Y.-S. Chien, Y.-P. Huang, R.-N. Tzeng, M.-S. Shy, T.-H. Lin, K.-H. Chen, C.-T. Chiu, C.-T. Chuang, W. Hwang, J.-C. Chiou, H.-M. Tong, K.-N. Chen, “Low-Temperature Bonded Cu/In Interconnect With High Thermal Stability for 3-D Integration,” IEEE Transactions on Electron Devices, 01/2014; 61(4):1131-1136. DOI: 10.1109/TED.2014.2304778 (SCI, IF: 2.358, Ranking: 44/247(17.8%)
Date of Publication	2015-06-12