年度 2011
全部作者 黃瑞彬
論文名稱 W. C. Wu, E. Y. Chang, R. B. Hwang, H. T. Hsu, L. H. Hsu, C. H. Huang, C. Kärnfelt, and H. Zirath, “Design, Fabrication, and Characterization of Novel Vertical Coaxial Transitions for Flip‐Chip Interconnects,” IEEE Transactions on Advanced Packaging, Vol. 32, NO. 2, pp 362‐371, 2009.
發表日期 2011-08-03