年度 2015
全部作者 邱俊诚
论文名称

C. H. Chiang, Y. C. Hu, K. H. Chen, C. T. Chiu, C. T. Chuang, W. Hwang, J.-C. Chiou, H. M. Tong, K. N. Chen, “Investigation of ICP Parameters for Smooth TSVs and Following Cu Plating Process in 3D Integration”, The 7th IMPACT 2012 Conference, Taipei, Taiwan, Oct 24-26, 2012.
发表日期 2015-06-12