年度	2017
全部作者	洪浩喬
論文名稱	P. M. Law, C.-W. Wu, H.-C. Hong, and L.-Y. Lin,  " An enhanced boundary scan architecture for inter-die interconnect leakage measurement in 2.5D and 3D packages," Proc. IEEE Asian Test Symposium (ATS), Taipei, Taiwan, Nov., 2017 (EI, IEEE)
發表日期	2017-11-01
語言	中文